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SOP, 4 - 72 Pins 0.65mm Pitch, 2" X 2" Grid EZ Version
Support up to 72 pins SO, SOP, QSOP, SSOP, TSSOP, PSSOP package IC with 0.65mm pitch, 37 pcs. of 0603 package and some thru hole passive components. 14 ground holes are connected a copper plane on the bottom side.
This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering
Populated RS-232 SchmartModule
Module 2 channels(2 transmit and 2 receive), RS232 and V.28-speeds up to 230Kb. Operates from a single 5V Power source, ESD protected in excess of +/- 15Kv. on all I/O lines, 4 LEDs(2 for transmit, 2 for receive), Preinstalled headers for transceiver lines, Preinstalled headers for +5v and Ground.
www.schmartboard.com/index.asp?page=products_populated&am...
202-0004-01
202-0004-01
SO, 4 - 56 Pins, 2" X 2" Grid EZ Version
Support up to 56 pins SO package IC with 0.050" pitch, 20 pcs. Of 0603 package and some thru hole passive components. 12 ground holes are connected a copper plane on the bottom side.
This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering
The Seaver Science Center is home to programs in the USC College of Letters, Arts and Sciences (Physics and Astronomy) and to USC Viterbi's Department of Electrical Engineering and the Communication Sciences Institute.
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
Doctoral candidate Matthew Cotter demonstrates how a computer can identify an object. (Photo credit: Curtis Chan)
Anatoly Maksimchuk, EECS Research Scientist, and John Nees, EECS Associate Research Scientist, demonstrate use of the HERCULES 300 TW laser in the Carl A. Gerstacker Building on North Campus of the University of Michigan in Ann Arbor, MI on September 5, 2017.
The HERCULES laser holds the Guiness World Records certificate for highest intensity focused laser, producing a beam of 2x10^22 W/cm^2 or 20 billion trillion watts per square centimeter.
Photo: Joseph Xu/Senior Multimedia Content Producer, University of Michigan - College of Engineering
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
Anatoly Maksimchuk, EECS Research Scientist, and John Nees, EECS Associate Research Scientist, demonstrate use of the HERCULES 300 TW laser in the Carl A. Gerstacker Building on North Campus of the University of Michigan in Ann Arbor, MI on September 5, 2017.
The HERCULES laser holds the Guinness World Records certificate for highest intensity focused laser, producing a beam of 2x10^22 W/cm^2.
Photo: Joseph Xu/Senior Multimedia Content Producer, University of Michigan - College of Engineering
Doctoral candidate Matthew Cotter demonstrates how a computer can identify an object. (Photo credit: Curtis Chan)
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
Doctoral candidate Matthew Cotter demonstrates how a computer can identify an object. (Photo credit: Curtis Chan)
This is the FPGA board we are using in the UC Berkeley CS 150 digital design lab. We used a Virtex 2000E FPGA chip.
The Journal of Electrical Engineering & Electronic Technology (JEEET) promotes rigorous research that makes a significant contribution in advancing knowledge for technologies ranging from global positioning system to electric power generation. JEEET includes all major themes pertaining to the use of electronic equipments and electrical energy.
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
SchmartBoard|ez 64 Pins, 0.5mm Pitch
This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering
Doctoral candidate Matthew Cotter demonstrates how a computer can identify an object. (Photo credit: Curtis Chan)
Doctoral candidate Matthew Cotter demonstrates how a computer can identify an object. (Photo credit: Curtis Chan)