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202-0005-01
SOP, 4 - 72 Pins 0.8mm Pitch, 2" X 2" Grid EZ Version
Support up to 72 pins SO, SOP, QSOP, SSOP, TSSOP, PSSOP package IC with 0.8mm pitch, 30 pcs. of 0603 package and some thru hole passive components. 14 ground holes are connected a copper plane on the bottom side.
This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering
Hanspeter Pfister, Gordon McKay Professor of the Practice of Computer Science, an expert in visualization, points to a detail of an image of the neural circuitry of the mouse brain. The detailed image is generated and rendered "on the fly" both on the video wall (behind) and on the touch sensitive tabletop display (in front).
202-0007-01
SOP, 4 - 72 Pins 0.5mm Pitch, 2" X 2" Grid EZ Version
Support up to 72 pins SO, SOP, QSOP, SSOP, TSSOP, PSSOP package IC with 0.5mm pitch, 43 pcs. of 0603 package, 8 pcs. of 0805 package and some thru hole passive components. 6 ground holes are connected a copper plane on the bottom side.
This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering
SOP, 4 - 72 Pins 0.65mm Pitch, 2" X 2" Grid EZ Version
Support up to 72 pins SO, SOP, QSOP, SSOP, TSSOP, PSSOP package IC with 0.65mm pitch, 37 pcs. of 0603 package and some thru hole passive components. 14 ground holes are connected a copper plane on the bottom side.
This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering
Populated RS-232 SchmartModule
Module 2 channels(2 transmit and 2 receive), RS232 and V.28-speeds up to 230Kb. Operates from a single 5V Power source, ESD protected in excess of +/- 15Kv. on all I/O lines, 4 LEDs(2 for transmit, 2 for receive), Preinstalled headers for transceiver lines, Preinstalled headers for +5v and Ground.
www.schmartboard.com/index.asp?page=products_populated&am...
202-0004-01
202-0004-01
SO, 4 - 56 Pins, 2" X 2" Grid EZ Version
Support up to 56 pins SO package IC with 0.050" pitch, 20 pcs. Of 0603 package and some thru hole passive components. 12 ground holes are connected a copper plane on the bottom side.
This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering
Students listen as Professor Dennis Freeman speaks about the EECS MEng program,
Photo: M. Scott Brauer
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
Anatoly Maksimchuk, EECS Research Scientist, and John Nees, EECS Associate Research Scientist, demonstrate use of the HERCULES 300 TW laser in the Carl A. Gerstacker Building on North Campus of the University of Michigan in Ann Arbor, MI on September 5, 2017.
The HERCULES laser holds the Guiness World Records certificate for highest intensity focused laser, producing a beam of 2x10^22 W/cm^2 or 20 billion trillion watts per square centimeter.
Photo: Joseph Xu/Senior Multimedia Content Producer, University of Michigan - College of Engineering
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
Doctoral candidate Matthew Cotter demonstrates how a computer can identify an object. (Photo credit: Curtis Chan)
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
The Seaver Science Center is home to programs in the USC College of Letters, Arts and Sciences (Physics and Astronomy) and to USC Viterbi's Department of Electrical Engineering and the Communication Sciences Institute.
Anatoly Maksimchuk, EECS Research Scientist, and John Nees, EECS Associate Research Scientist, demonstrate use of the HERCULES 300 TW laser in the Carl A. Gerstacker Building on North Campus of the University of Michigan in Ann Arbor, MI on September 5, 2017.
The HERCULES laser holds the Guinness World Records certificate for highest intensity focused laser, producing a beam of 2x10^22 W/cm^2.
Photo: Joseph Xu/Senior Multimedia Content Producer, University of Michigan - College of Engineering
Doctoral candidate Matthew Cotter demonstrates how a computer can identify an object. (Photo credit: Curtis Chan)
1.0mm Pitch SMT Connector Board
1.0 mm Pitch Connectors up to 72 Pins
Supports all "Top Latch" FFC type SMT Connectors. (Does not support "Bottom Latch" type).
www.schmartboard.com/index.asp?page=products_connectors&a...
This is the FPGA board we are using in the UC Berkeley CS 150 digital design lab. We used a Virtex 2000E FPGA chip.
The Journal of Electrical Engineering & Electronic Technology (JEEET) promotes rigorous research that makes a significant contribution in advancing knowledge for technologies ranging from global positioning system to electric power generation. JEEET includes all major themes pertaining to the use of electronic equipments and electrical energy.
Cal Poly EE Senior Project 2011 Showcase
Cal Poly Electrical Engineering Spring Senior Project Showcase
Doctoral candidate Matthew Cotter demonstrates how a computer can identify an object. (Photo credit: Curtis Chan)