View allAll Photos Tagged microelectronics

Dr. Mehdi Hatamian, Vice President of Engineering, DSP Microelectronics, Broadcom Corporation.

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

12-7-18 Graduation Ceremony

12-7-18 Graduation Ceremony

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

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Ivris Raymond, right, speaks with Kalab Assefa, left, during the AI Inside and Out Summer Camp in the H.H. Dow Building on the University of Michigan’s North Campus in Ann Arbor on Friday, July 11, 2025. Both are Ph.D. students in computer science and engineering.

 

The AI Inside and Out Summer Camp introduces high school students to the world of artificial intelligence, combining hands-on projects, lab tours, and guided lessons to explore how data, software, and hardware come together to power today’s cutting-edge AI systems. In partnership with Michigan Advanced Vision for Education and Research in Integrated Circuits (MAVERIC), the program offers students an in-depth introduction to microelectronics and semiconductor research while exploring the future of AI innovation.

 

Photo: Brenda Ahearn/University of Michigan, College of Engineering, Communications and Marketing

Microelectronics Research Center in the Georgia Tech Campus.

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

A photo of the stock for the company UMC United Microelectronics Corporation.

An institution which resides on-campus at the University of Pretoria and serves the faculty of electronics via microelectronics.

 

Taken by: Aidrian Linge

@ ST Microelectronics, Castelletto 4sq.com/151Upxz (posted via FlickSquare)

Welcome to my lab at the microelectronics lab at MIT. I'm wearing that MIT shirt that I got from visit day years ago.

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

In the microelectronics department of the Deutsche Museum, Munich.

12-7-18 Graduation Ceremony

12-7-18 Graduation Ceremony

12-7-18 Graduation Ceremony

Dr. Mehdi Hatamian, Vice President of Engineering, DSP Microelectronics, Broadcom Corporation.

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

12-7-18 Graduation Ceremony

High school students Dhruv Gupta, far left, Arnav Gupta, left, and Aarav Gupta, right, get some help from Kalab Assefa, a Ph.D. student in computer science and engineering, as they monitor the output from a real-time computer vision system during the AI Inside and Out Summer Camp in the H.H. Dow Building on the University of Michigan’s North Campus in Ann Arbor on Friday, July 11, 2025.

 

The AI Inside and Out Summer Camp introduces high school students to the world of artificial intelligence, combining hands-on projects, lab tours, and guided lessons to explore how data, software, and hardware come together to power today’s cutting-edge AI systems. In partnership with Michigan Advanced Vision for Education and Research in Integrated Circuits (MAVERIC), the program offers students an in-depth introduction to microelectronics and semiconductor research while exploring the future of AI innovation.

 

Photo: Brenda Ahearn/University of Michigan, College of Engineering, Communications and Marketing

12-7-18 Graduation Ceremony

12-7-18 Graduation Ceremony

12-7-18 Graduation Ceremony

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

The Engineering 3 is the newly constructed building that was planned for parking purpose on campus. It is situated opposite the engineering 2 and microelectronics buildings. The construction for the building started earlier in 2010, completed this year(2011) and the opening of the building was on 25 August 2011

Dr. Mehdi Hatamian, Vice President of Engineering, DSP Microelectronics, Broadcom Corporation.

Giovedì 25 marzo - Ore 7.45

ST Microelectronics - Agrate Brianza

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

UNITED MICROELECTRONICS CORPORATION (SINGAPORE BRANCH)

Copyright © 2023 Yao Hui. All rights reserved. This photograph should not be used for any type of media and format without official permission from photographer Yao Hui.

 

For commission or more information, please email me: yaohuier@gmail.com

12-7-18 Graduation Ceremony

In the microelectronics department of the Deutsche Museum, Munich.

Dr. Mehdi Hatamian, Vice President of Engineering, DSP Microelectronics, Broadcom Corporation.

The new engineering building under construction by McLaughlin & Harvey and budgeted to cost £52m.

 

Designed by the Building Design Partnership (BDP) and Gardiner and Theobald LLP to include: a 120-person conference room; two 50-seat class rooms; a computer teaching laboratory and a Power Teaching Lab; and new offices for the School’s Engineering Teaching Organisation. It will be home to the Institute of Energy Systems which conducts research in low carbon energy systems, technology and policy. The building has a sustainable design and a rooftop photovoltaic array which will convert sunlight into renewable energy to power the building.

 

It is in the the southwest corner of the campus, next to the FloWave Ocean Energy Research Facility, the Scottish Microelectronics Centre and the Roger Land Building.

 

estates.ed.ac.uk/campus-development/kings-buildings/curre...

 

science-engineering.ed.ac.uk/news-events/current-year/new...

Giovedì 25 marzo - Ore 7.45

ST Microelectronics - Agrate Brianza

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