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新興材料發展進程(Emerging Materials Roadmap)計畫經理Michael Gartner博士也上台加入英特爾技術長Justin Rattner的行列，在英特爾科技論壇中探討新式矽晶片科技研究的重要性，這能讓摩爾定律(Moore’s Law)延長達十年以上
Located at Intel headquarters in Santa Clara, CA, the Intel Museum was redesigned in June 2011 with new interactive exhibits and activities great for kids and fans of technology innovation. The museum attracts over 120,000 people each year (as of 2011). More details here intel.ly/mWwGpn.
it runs hot, but it runs! cpu is sse3 capable, EM64 support. well, may be it is soldered by intel robots, but the chipset is actually from sis. www.intel.com/products/motherboard/D201GLY2/index.htm
nevertheless i like it, it's got 2 satata ports and boots from usb.
Intel Corporation est une entreprise américaine fondée le 18 juillet 1968 par Gordon Moore, Robert Noyce et Andrew Grove. Elle est le premier fabricant mondial de semi-conducteurs si on se base sur le chiffre d'affaires
Priscila Oliveira Andre.
"Performances de agentes curtentes ecológicos no curtimento de peles de peixes tilápias".
As seen at the Lipizzaner show at the Intel Core i7 Launch in Johannesburg, South Africa.
See here for more.
Fun at the Intel Museum
dclindesign.wordpress.com/2011/12/02/intel-inside/
Location: Intel Museum
Leica M9 + Leica 50mm f/0.95 Noctilux
Located at Intel headquarters in Santa Clara, CA, the Intel Museum was redesigned in June 2011 with new interactive exhibits and activities great for kids and fans of technology innovation. The museum attracts over 120,000 people each year (as of 2011). More details here intel.ly/mWwGpn.
As seen at the Lipizzaner show at the Intel Core i7 Launch in Johannesburg, South Africa.
See here for more.
Der Ingot wird in einzelne dünne Silizium-Scheiben zersägt, die man als „Wafer“ bezeichnet.
Die Wafer werden nun so lange poliert, bis sie makellose, spiegelglatte Oberflächen aufweisen. Intel kauft solche produktionsfertigen Wafer von Drittanbietern ein. Für den zukunftsweisenden „High-K/Metal Gate“-Produktionsprozess mit 32 Nanometer Strukturbreite verwendet Intel Wafer mit einem Durchmesser von 300 Millimetern. Als Intel mit der Chip-Fertigung begann, verwendete man noch kleine 50-Millimeter-Wafer – die aktuellen 300-Millimeter-Scheiben erlauben demgegenüber drastisch reduzierte Fertigungskosten pro Chip.
7/4/11***NO REPRO FEE***Minister for Education Ruairi Quinn pictured with Brendan Cannon, Director of Corporate Affairs, Intel Ireland, at the launch of Intel's eSchools laptop initiative at Christ the King Girl's School, Cabra.Pic:Marc O'Sullivan
As seen at the Lipizzaner show at the Intel Core i7 Launch in Johannesburg, South Africa.
See here for more.