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Lawrence Livermore National Laboratory is developing several microelectromechanical-based sensors, which are fabricated from silicon with techniques similar to those used by the electronics industry. MEMS-based sensors are ideal for use in warheads because of their small dimensions, material properties, low power consumption, and mass manufacturability. Embedded sensors must fit into spaces not originally designed to accommodate them. As a result, they must be extremely thin (about one-half the thickness of a human hair) and be able to bend, flex, and stretch to conform to any curved surface. The flexible array of 900 contact stress sensors shown here can conform to any shape. [More information]
A false-color image of a microelectromechanical device. The diamond-based actuator is colored gold. Image credit: Ani Sumant, Argonne National Laboratory.
PI: Subramanian Sankaranarayanan, Argonne National Laboratory
This work led to the development of a material that exhibited superlubricity at the macroscale for the first time. The material could potentially be used for applications in dry environments, such as computer hard drives, wind turbine gears, and mechanical rotating seals for microelectromechanical and nanoelectromechanical systems. In addition, the knowledge gained from this study is expected to spur future efforts to develop materials capable of superlubricity for a wide range of mechanical applications.
This large-scale simulation depicts a phenomenon called superlubricity, a property in which friction drops to near zero. The simulation reveals that this condition originates at the nanoscale when graphene atoms self-assemble into nanoscrolls that reduce contact area to help eliminate friction.
Image credit: Sanket Deshmukh, Joseph Insley, and Subramanian Sankaranarayanan, Argonne National Laboratory
Scientific discipline: Materials Science
This research used resources of the Argonne Leadership Computing Facility at Argonne National Laboratory.
Professor Liwei Lin
Liwei Lin
Professor
Specialist of the Organization Department of the Central Committee of the CPC“Thousand Talents Program”, professor of Yangtze river scholars, Mechanical Engineering School professor of the University of California, Berkeley, co-director of the Berkeley Sensor and Executive Component Research Center, president of the American Society of Mechanical Engineers Micro-Electro-Mechanical Systems Branch, published about 130 theses on many international well-known journals, such as IEEE/ASME Journal of Microelectromechanical Systems, Nano Letters, Advanced Materials, ACS Nano, Nanotechnology Review etc, published about 200 theses on many main conference in this area, such as IEEE-MEMS, Transducer etc, co-authoring 4 monographs, authorized 17 invention patents, relative achievements were highlighted reported by many well-known medias, such as Science, LA Times, NHK Japan and Science Channel TV, had a wide international response. Now he hold a concurrent post of the chief editor of IEEE/ASME Journal of Microelectromechanical Systems and Chinese Journal of Sensors and Actuators, the editor of the ASME Journal of Micro- and Nano-Manufacturing , Chinese Journal of Sensors and Actuators, the reviewer of more than 20 journals, such as Science, Nature Nanotechnology, Nano Letters and Advanced Materials etc, the co-chair of the IEEE-MEMS 2011 Conference, the program committee chair of IEEE-NEMS 2010 and many other IEEE-NEMS, was well-known in the micro nano technology area.
Research Area
MEMS/NEMS, micro nano sensor and actuator, micro nano integration and encapsulation, polymer nano structure and its application, flexible electronic manufacturing technology, nanofiber manufacturing and application, micro nano 3D printing technology etc.
Part of Treatises
Yifang Liu,Daner Chen,Liwei Lin,Gaofeng Zheng, Jianyi Zheng, Lingyun Wang*,Daoheng Sun*,Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure, Journal of Micromechanics and Microengineering, 2016, 26: 035018-035026.
Lei Xu*, Wen Han, Gaofeng Zheng, Dezhi Wu, Xiang Wang, Daoheng Sun*, Initial jet before the onset of effective electrospinning of polymeric nanofibers, The Open Mechanical Engineering Journal, 2015, 9: 666-669.
Dezhi Wu, Shaohua Huang, Zhiqin Xu, Zhiming Xiao, Chuan Shi, Jinbao Zhao, Rui Zhu, Daoheng Sun*, Liwei Lin, Polyethylene terephthalate/poly (vinylidene fluoride) composite separator for Li-ion battery, Journal of Physics D:Applied Physics, 2015, 48: 285305-285312.
[6] Tingping Lei, Lingke Yu, Lingyun Wang, Fan Yang, Daoheng Sun*, Predicting polymorphism of electrospun polyvinylidene fluoride membranes by their morphologies, Journal of Macromolecular Science, 2015, 54: 91-101.
Xiang Wang, Xingwang Hu, Xiaochun Qiu, Xiangyu Huang, Dezhi Wu*, Daoheng Sun*, Strip-distributed polymer solution on tip-less electrospinning for uniform nanofibers, Materials Letters, 2013, 99: 21-23.
Lei Xu, Daoheng Sun*, Electrohydrodynamic printing under applied pole-type nozzle configuration, Applied Physics Letters, 2013,102(2): 024101.
WangLingyun, DuJiang, Luo Zhiwei, Du Xiaohui, Li Yipan, Liu Juan, Daoheng Sun*. Design and Experiment of a Jetting Dispenser Driven by Piezostack Actuator [J]. IEEE Transactions on Components Packaging and Manufacturing Technology, 2013, 3(1): 147-156.
Xiang Wang, Gaofeng Zheng, Lei Xu, Wei Cheng, Bulei Xu, Yongfang Huang, Daoheng Sun*, Fabrication of nanochannels via near-field electrospinning, Appled Physics A, 2012, 108(4): 825-828.
Wang Linyun, Qiu Yongrong, Pei Yanbo, Su Yuanzhe, Zhan Zhan, Lv Wenlong, Daoheng Sun*. A novel electrohydrodynamic printing jet head with retractable needle[J]. Proceedings of the Institution
Zheng Gaofeng, Wang Xiang, Li Wenwang, Lei Tingping, Tao Wei, Du Jiang, Qiu QiYan, Chi XinGuo, Daoheng Sun*. Single step fabrication of organic nanofibrous membrane for piezoelectric vibration sensor [C]. Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International Conference: 2782-2785.
Daoheng Sun*, Chieh Chang, Sha Li, and Liwei Lin*,Near-Field Electrospinning, Nano Letters,Department of Mechanical Engineering and Berkeley Sensor and Actuator Center,Received February 6, 2006; Revised Manuscript Received March 9, 2006
Part of Patents
A polymer solar battery light trapping structure manufacturing method.
A micro devices movable structure manufacturing method which based on silicon/glass anode bonding.
A horizontal array carbon nanotube manufacturing method.
A SCIENTIST PREPARES THE NANOTUBE OVEN USED IN EXPERIMENTS IN CONJUNCTION WITH JEFFERSON LAB'S FREE ELECTRON LASERS (FELS) AT THE THOMAS JEFFERSON NATIONAL ACCELERATOR FACILITY.
THE FREE ELECTRON LASER HELPS SCIENTISTS FIND OUT HOW AND WHY CARBON NANOTUBES FORM. THEY ARE EXTREMELY STRONG AND VERSATILE CYLINDERS SO TINY THAT MILLIONS COULD FIT ON A TIP OF A PIN. IN BUNCHES, THEY LOOK LIKE BLACK SNOWFLAKES. CNTS CAN BE USED IN MOLECULAR AND QUANTUM COMPUTING AND MICROELECTROMECHANICAL SENSORS (MEMS) OR AS "LAB-ON-A-CHIP". CNTS CAN BE USED IN HIGHLY TECHNICAL COMPUTING AND SCIENTIFIC APPLICATIONS TO DETECT TOXINS AND NERVE ARGENTS IN TINY AMOUNTS. NANOTUBES MAKE POSSIBLE STRONGER YET LIGHTER STEEL.
For more information or additional images, please contact 202-586-5251.
THE WORLD'S SMALLEST MICRO-CHAIN DRIVE FABRICATED AT SANDIA NATIONAL LABORATORY.
THIS SANDIA DEVELOPED SILICON MIRCO-CHAIN RESEMBLES A BICYCLE CHAIN, EXCEPT THAT EACH LINK COULD REST COMFORTABLY ON A HUMAN HAIR. MICROELECTROMECHANICAL SYSTEMS ARE BEING DEVELOPED AT SANDIA IN THE MICROELECTRONICS DEVELOPMENT LAB. THE MDL IS A WORLD CLASS FABRICATION FACILITY DEDICATED TO PROVIDING DEVELOPMENT AND ENGINEERING CAPABLITIES TO SUPPORT INDUSTRY, GOVERNMENT AND PROGRAMS OF NATIONAL INTEREST.
For more information or additional images, please contact 202-586-5251.
A PROTOTYPE OF THE MEMS-BASED ARRAY DESIGNED TO BE PLACED ONTO THE RETINA OF A BLIND PERSON.
DOE'S ARGONNE, OAK RIDGE, LAWRENCE LIVERMORE AND SANDIA NATIONAL LABORATORIES ARE PARTNERING WITH USC AND NORTH CAROLINA STATE UNIVERSITY TO DESIGN TINY MEMS (MICROELECTROMECHANICAL SYSTEMS) ELECTRODES. THE ELECTRODES WOULD BE IMPLANTED IN THE EYE ON THE SURFACE OF THE RETINA. THIS MICRO-ELECTRODE ARRAY WOULD PERFORM THE FUNCTION OF NORMAL PHOTO-RECEPTIVE CELLS, RESTORING VISION TO PATIENTS WITH RETINAL DISORDERS.
For more information or additional images, please contact 202-586-5251.
MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) BEING TESTED.
MACHINES THAT ARE SO SMALL THEY CAN'T BE SEEN WITH THE NAKED EYE NEED SPECIAL TESTING METHODS. THESE TINY MACHINES ARE PART OF THE MICROELECTROMECHANICAL SYSTEMS (MEMS) AT SANDIA. MEMS DEVICES ARE CREATED IN THE MICROELECTRONICS DEVELOPMENT LAB AT SANDIA. THE MDL IS A WORLD CLASS FABRICATION FACILITY DEDICATED TO PROVIDING DEVELOPMENT AND ENGINEERING CAPABILITIES TO SUPPORT INDUSTRY, GOVERNMENT AND PROGRAMS OF NATIONAL INTEREST.
For more information or additional images, please contact 202-586-5251.
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Carrier Plates with tac surfaces are designed to precisely align critical devices and components on production lines.
The tac carrier plates have been used for Back End of Line (BEOL) processing and assembling
Microelectromechanical Systems (MEMS) such as sensors and actuators.
Elasticity of tac sheet absorbs impact to protect critical devices.
Customize adhesive level of tac sheet to be used for any application.
Customize tac sheet material and size.
Customize base material, thickness and size, up to 210mm (8.27in) x 297mm (11.69in).
Duffield Hall, named for Cornell Engineering alumnus David Duffield '62 EE, is one of the country's most sophisticated research and teaching facilities for nanoscale science and engineering. It supports research and instruction in electronic and photonic devices, microelectromechanical devices, advanced materials processing, and biotechnology devices. The facility allows the university to bring together many of the various nanotechnology and materials-development groups that previously did their work independently in various parts of the campus. It includes a large atrium that provides a space where faculty and students can interact in a relaxed, attractive environment, particularly during the winter months.
Author: Albert Folch (then postdoc at the Massachussets Institute of Technology with Prof. Martin Schmidt's group in the EECS Dept.).
For details, see A. Folch, M.S. Wrighton, and M.A. Schmidt, "Microfabrication of ultra-sharp Si tips on Si3N4 cantilevers for atomic force microscopy", Journal of Microelectromechanical Systems 6, 303-306 (1997).
Author: Albert Folch (then postdoc at the Massachussets Institute of Technology with Prof. Martin Schmidt's group in the EECS Dept.).
This SEM micrograph shows a cantilever with a tip that is half-etched (the hat serves as a mask to produce the tip by under-etching). It looks like a small picnic table at the end of a precipice ...
For details, see A. Folch, M.S. Wrighton, and M.A. Schmidt, "Microfabrication of ultra-sharp Si tips on Si3N4 cantilevers for atomic force microscopy", Journal of Microelectromechanical Systems 6, 303-306 (1997).
Masoud Agah, director of Virginia Tech's Microelectromechanical Systems Laboratory. Agah and other researchers at Virginia Tech have shown positive signs in creating a new way to screen for breast cancer.
1999 NSF CAREER: Cyclic Plasticity and Fatigue Life of Small-Scale Metal Structures
Richard Vinci serves as professor of materials science and as director of Lehigh's Center for Advanced Materials and Nanotechnology. His research focuses on the processing and mechanical behavior of thin films for microelectrics and microelectromechanical systems (MEMS) applications. He is also interested in multidisciplinary research, including the development of novel glass substrates for DNA array chips. Dr. Vinci has obtained competitive grants from the National Science Foundation, U.S. Army Research Office, Department of Commerce, and Defense Advance Research Projects Agency, as well as equipment grants from the Office of Naval Research and National Science Foundation.
Polymer MEMS based structure with stress inducing structures. Directional self-assembly is achieved.
Xiaobao Geng, Department of Mechanical Engineering - Engineering Mechanics Advisor:Dr. Dennis D. Meng
A self-adaptive thermal switch array (TSA) based on actuation by low-melting-point alloy (LMA) droplets is reported to stabilize the temperature of a heat-generating MEMS device at a predetermined range (i.e., the optimal working temperature of the device) with neither control circuit nor electrical power consumption. Many microdevices, in form of microelectromechanical systems (MEMS), work best in certain temperature ranges, usually higher than room or ambient temperature, such as microbatteries, microfuel cells, chemical sensors, micro total analysis systems (TAS), and chip scale atomic clocks. There has been growing demand for more sophisticated temperature regulation schemes to stabilize the working temperature when the operational mode changes frequently or environmental temperature fluctuates dramatically (e.g., in outer space or desert areas). We propose a self-adaptive thermal switch array (TSA), which can be actuated by low melting point alloy (LMA) during its phase change. When the temperature is below this range, the TSA stays off and works as a thermal insulator. Therefore, the MEMS device can quickly heat itself up to its optimal working temperature during startup. Once this temperature is reached, TSA is automatically turned on to increase the thermal conductance, working as an effective thermal spreader. As a result, the MEMS device tends to stay at its optimal working temperature without complex thermal management components and the associated parasitic power loss. A prototype TSA was fabricated and characterized to prove the concept. The stabilization temperatures under various power inputs have been studied both experimentally and theoretically. Under the increment of power input from 3.8 W to 5.8 W, the temperature of the device increased only by 2.5C due to the stabilization effect of TSA.
The prototype deformable mirror (see following image for the other side) above is made of an etched silicon microelectromechanical system which has 1,024 actuators that adjust the shape of the mirror hundreds of times per second. This enables astronomers to correct for air turbulence and atmospheric disturbances which limit the ability of telescopes to see detail.
See Blatherings for more details.
The prototype deformable mirror above is made of an etched silicon microelectromechanical system which has 1,024 actuators that adjust the shape of the mirror hundreds of times per second. This enables astronomers to correct for air turbulence and atmospheric disturbances which limit the ability of telescopes to see detail.
See Blatherings for more details.
An artist’s illustration of a graphene crystal, displaying the association of carbon atoms in a hexagonal sample. AlexanderAIUS, CC BY-SA 3.0
| Photograph Credit score: AlexanderAIUS, CC BY-SA 3.0
Researchers within the UK, led by Nobel laureate Andre Geim, have found one other property of graphene – a single-atom-thick layer of carbon atoms bonded in a honeycomb sample – that additional distinguishes this ‘surprise’ materials.Dr. Geim & co. discovered that graphene shows an anomalous big magnetoresistance (GMR) at room temperature.GMR is the results of {the electrical} resistance of a conductor being affected by magnetic fields in adjoining supplies. It's utilized in harddisk drives and magnetoresistive RAM in computer systems, biosensors, automotive sensors, microelectromechanical programs, and medical imagers.GMR-based gadgets are significantly used to sense magnetic fields. The brand new research has discovered {that a} graphene-based system, not like standard counterparts, wouldn’t should be cooled to a really low temperature to sense these fields. The discovering was published in Nature on April 12.What's GMR?
An illustration of the circumstance by which GMR seems. The large arrows point out the path of the magnetic area. ‘FM’ stands for ferromagnetic materials and ‘NM’ for non-magnetic materials.
| Photograph Credit score:
Guillom, CC BY-SA 3.0
Say a conductor is sandwiched between two ferromagnetic supplies (generally, metals drawn to magnets, like iron).
kninfocare.com/whats-magnetoresistance-its-another-factor...
Organic and machine fusion, also known as "biohybrid" systems, is a rapidly growing area of research that combines the benefits of organic materials with the power of machine-based technologies. These systems have the potential to revolutionize fields such as medicine, energy, and agriculture by harnessing the strengths of both natural and artificial materials.
In biohybrid systems, organic materials such as cells, tissues, or microorganisms are combined with machine-based technologies such as sensors, actuators, or microelectromechanical systems (MEMS) to create new types of devices or systems. For example, researchers are working on biohybrid robots that use living cells to power their movement. Another exciting development in biohybrid systems is the creation of biofuel cells that can generate electricity using the enzymes found in living cells. These cells have the potential to provide a sustainable and renewable source of energy.
Iot sensors are widely used to collect data. different types of applications like ir sensors,temperature,microelectromechanical system and optical,acoustic sensors etc
A #microelectromechanical system that converts low-frequency vibrations into electricity from low-power energy sources of the environment, will potentially remove the need for batteries completely . Visit Poornima Group of Colleges- Best engineering colleges in rajasthan
According to HTF Market Intelligence, the Global System in Package Technology market to witness a CAGR of 9.8% during forecast period of 2023-2028. The market is segmented by System in Package Technology Comprehensive Study by Application (Consumer Electronics, Medical, Automotive, Telecom, Aerospace and Defense, Industrial System, Others), Package Type (Ball Grid Array (BGA), Surface Mount Package, Pin Grid Array (PGA), Flat Package (FP), Other), Device (RF Front-End, RF Amplifier, Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), Baseband Processor, Application Processor, Others), Packaging Method (Flip Chip, Wire Bond), Chip Configuration (Side by Side Placement, Stacked Structure, Embedded Structure), Packaging Technology (2D IC, 2.5D IC, 3D IC), SiP Technology Platform (Solder Bumping, Flip-Chip Assembly, Thin Film Substrate, Printed Circuit Board). The System in Package Technology market size is estimated to increase by USD 8.02 Billion at a CAGR of 9.8% from 2023 to 2028. The report includes historic market data from 2017 to 2022E. Currently, market value is pegged at USD 8.68 Billion. Get Detailed TOC and Overview of Report @
www.htfmarketintelligence.com/report/global-system-in-pac...