UTC2000 Controller Enables Simple and Quick Implementation of Popular Reversible-Plug Connector for USB Devices and USB Cabling Into Wide Range of Applications.

 

Microchip announced the addition of the UTC2000, USB-C™ controller to its leading portfolio of USB devices. With this new device, designers of a wide range of applications covering the consumer, industrial and automotive markets can now simply and quickly implement the radically updated USB-C connector cost effectively, speeding time to market and minimizing bills of materials. Housed in a 16-pin QFN package, the UTC2000 controller’s small form factor also enables the deployment of USB-C connectors in mobile applications. To learn more about the USB-C connector revolution, visit: www.microchip.com/USB-C-081715a

Microchip announced the industry’s first MOST150 coaxial transceiver. Extending the usage of coaxial cabling to powerful automotive infotainment networks based on the latest MOST150 standard, the newly introduced OS82150 integrates a coaxial cable driver and coaxial cable receiver into a small-footprint, 4x4 mm QFN package. To learn more about MOST® technology, the de-facto networking standard for automotive infotainment, please visit www.microchip.com/MOST-090115a.

 

Microchip announced the industry’s first MOST150 coaxial transceiver. Extending the usage of coaxial cabling to powerful automotive infotainment networks based on the latest MOST150 standard, the newly introduced OS82150 integrates a coaxial cable driver and coaxial cable receiver into a small-footprint, 4x4 mm QFN package. To learn more about MOST® technology, the de-facto networking standard for automotive infotainment, please visit www.microchip.com/MOST-090115a.

 

This is an adapter board for a 16-pin TSSOP device. The pattern was cut using the hobby knife for the fine work (right up at the pins) and the Dremel for the rest.

 

See? TSSOPs aren't so bad.

 

QFNs work the same way but you have to cut pads for all four sides.

Microchip announced its new 5 GHz, 50 ohm Matched WLAN Front End Module (FEM)—the SST11LF04—for high data rate mobile device applications. The SST11LF04 features a transmitter power amplifier, a receiver low-noise amplifier with bypass and a low-loss, single-pole two-throw antenna switch for 5 GHz WLAN connectivity into one integrated, compact 2.5x2.5x0.4 mm, 16-pin QFN package, making it ideal for high-data-rate mobile device applications. With its small footprint, high linear output power of up to 16 dBm and 17 dBm, at 3.3V and 5V Vcc respectively—for 1.75% dynamic EVM using MCS9-HT80 modulation and 80 MHz bandwidth along with 18 dBm and 19 dBm linear power for 3% EVM at 3.3V and 5V, respectively—the SST11LF04 extends the range of IEEE 802.11a WLAN system while providing exceptional transmit power at the maximum 11ac high-data–rate modulation. The receiver has a 12 dB gain and a greater than -6 dBm input (1 dB) compression level. In LNA bypass mode, the receiver has a 2.5 dB noise figure and an -6 dBm input compression level. For more info, visit: www.microchip.com/get/K6WW

Microchip announced its latest 2.4 GHz, 50 ohm Matched RF WLAN Front End Module (FEM)—the SST12LF09—for Bluetooth® connectivity, as well as 802.11b/g/n and 256-QAM Wi-Fi® applications. The SST12LF09 integrates a transmitter power amplifier, a receiver low-noise amplifier, and a low-loss, single-pole three-throw antenna switch for Bluetooth connectivity into one compact 2.5x2.5x0.4 mm, 16-pin QFN package, making it ideal for high-data-rate wireless applications. With its high linear output power of up to 15 and 17 dBm for 1.8% dynamic EVM at 3.3V and 5V, respectively—along with 17 and 18.5 dBm linear power for 3% EVM at 3.3V and 5V, respectively—this FEM significantly extends the range of IEEE 802.11b/g/n WLAN systems while providing excellent transmit power at the maximum 256-QAM data rate. The receiver has a 12 dB gain and a greater than -6 dBm input (1 dB) compression level. In the LNA bypass mode, the receiver has a 9 dB loss and an 8 dBm input compression level. For more info, visit: www.microchip.com/get/95TE

Microchip announced its new 5 GHz, 50 ohm Matched WLAN Front End Module (FEM)—the SST11LF04—for high data rate mobile device applications. The SST11LF04 features a transmitter power amplifier, a receiver low-noise amplifier with bypass and a low-loss, single-pole two-throw antenna switch for 5 GHz WLAN connectivity into one integrated, compact 2.5x2.5x0.4 mm, 16-pin QFN package, making it ideal for high-data-rate mobile device applications. With its small footprint, high linear output power of up to 16 dBm and 17 dBm, at 3.3V and 5V Vcc respectively—for 1.75% dynamic EVM using MCS9-HT80 modulation and 80 MHz bandwidth along with 18 dBm and 19 dBm linear power for 3% EVM at 3.3V and 5V, respectively—the SST11LF04 extends the range of IEEE 802.11a WLAN system while providing exceptional transmit power at the maximum 11ac high-data–rate modulation. The receiver has a 12 dB gain and a greater than -6 dBm input (1 dB) compression level. In LNA bypass mode, the receiver has a 2.5 dB noise figure and an -6 dBm input compression level. For more info, visit: www.microchip.com/get/K6WW

UTC2000 Controller Enables Simple and Quick Implementation of Popular Reversible-Plug Connector for USB Devices and USB Cabling Into Wide Range of Applications.

 

Microchip announced the addition of the UTC2000, USB-C™ controller to its leading portfolio of USB devices. With this new device, designers of a wide range of applications covering the consumer, industrial and automotive markets can now simply and quickly implement the radically updated USB-C connector cost effectively, speeding time to market and minimizing bills of materials. Housed in a 16-pin QFN package, the UTC2000 controller’s small form factor also enables the deployment of USB-C connectors in mobile applications. To learn more about the USB-C connector revolution, visit: www.microchip.com/USB-C-081715a

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Microchip announced its latest 2.4 GHz, 50 ohm Matched RF WLAN Front End Module (FEM)—the SST12LF09—for Bluetooth® connectivity, as well as 802.11b/g/n and 256-QAM Wi-Fi® applications. The SST12LF09 integrates a transmitter power amplifier, a receiver low-noise amplifier, and a low-loss, single-pole three-throw antenna switch for Bluetooth connectivity into one compact 2.5x2.5x0.4 mm, 16-pin QFN package, making it ideal for high-data-rate wireless applications. With its high linear output power of up to 15 and 17 dBm for 1.8% dynamic EVM at 3.3V and 5V, respectively—along with 17 and 18.5 dBm linear power for 3% EVM at 3.3V and 5V, respectively—this FEM significantly extends the range of IEEE 802.11b/g/n WLAN systems while providing excellent transmit power at the maximum 256-QAM data rate. The receiver has a 12 dB gain and a greater than -6 dBm input (1 dB) compression level. In the LNA bypass mode, the receiver has a 9 dB loss and an 8 dBm input compression level. For more info, visit: www.microchip.com/get/95TE

SchmartBoard|ez 36 Pins .5mm & 32 Pins .65mm

 

www.schmartboard.com/index.asp?page=products_csp&id=277

The Allegro A6281 3-LED PWM driver. It's a 3mm QFN-16. I thought I'd deadbug prototype it due to impatience for real PCBs, and a little challenge....

Someone posted photos of a deadbugged 3x3mm QFN. This reminded me of an even smaller part I deadbugged.

 

This is a 1.6x1.6mm chip scale package. The actual IC die has extra-large bond pads with some special processing to prevent contamination. The solder balls are 0.5mm apart.

 

I hear they have CSP parts with 0.4mm spacing between solder balls...

SchmartBoard|ez .5mm - 16 and 28 Leads, .65 mm - 20 Leads, .8 mm 12 and 16 Leads

 

This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering

 

www.schmartboard.com/index.asp?page=products_csp&id=125

PCB for cc1100 wireless tranceiver (reference design). I needed to prototype a few wireless sensor platforms (aka smartdust, motes) using the brand spanking new cc1100 tranceiver from chipcon/ti. This chip only comes in a qfn package, with a bottom pad (the primary ground) that MUST be soldered to the PCB. There was no way I could do this middle pad by hand, so I tried the griddle reflow method. Passive/supporting components are 0402 size (0.5mm by 1mm). These photos document the PCB fabrication using inkjet transparencies and a test solder reflow using a griddle (thanks spark fun). I'm astounded, tiny prototypes made entirely in my kitchen!

 

About the PCB making process: the PCBs were make using the photo process with photo-positive pre-coated boards. Artwork was printed on an inkjet transparency using all black ink. The printer was set to its maximum resolution (something like a fake 2400 dpi). Two copies of the art were taped together to give a thicker mask. I think that I could do it in a single layer if I printed using all colors for black (called high quality black on my printer), or using photographic cartridges with uv resistant ink. As of yet, I am to cheap to buy a new cartridge. I'm thinking of asking the inkjet refill shop if they would fill an empty black cartridge with a UV resistant color ink.

 

About the reflow: I used the sparkfun griddle reflow method. The solder paste was a $5 tube of "silver solder paste" from mouser. I made a small pool of paste on a note card. I dipped the syringe tip in the solder and dotted the pads on the board. I cranked the griddle up (240c) and in five minutes the parts were soldered and aligned.

 

About the cc1100: the cc1100 is a low power tranceiver for wireless networks. It is a big upgrade from the cc1000 used in many previous generations of MOTES (mica2, mica2dot, etc). I had a really hard time actually getting the cc1100 - ti won't sample and distributors all list them on back order if you don't want a whole reel. The boards shown here will use a draft (E) revision of the silicon. That was the only thing I could find anywhere in the world. I hope to get my hands on the final silicon soon (hint, hint TI).

Microchip expanded its RF portfolio with the new SST11CP16 5 GHz power amplifier (PA). This PA supports the new IEEE 802.11ac ultra high data rate Wi-Fi® standard for 351 Mbps with 1.8% Error Vector Magnitude (EVM) at 19 dBM output power, enabling a longer range. Additionally, the SST11CP16 provides low operating current of 360 mA at 22 dBm, which enables more transmission channels at a higher data rate, per system. To conserve space, this PA is offered in a 3x3x.45 mm, 16-pin QFN package. For more info, visit: www.microchip.com/get/D2JG

Finally getting back to work on an accelerometer noisemaker.

MMA8451Q 3axis 14b i2c. Hand soldered qfn-16!

Microchip Technology Inc. announced the new SST11CP15 RF power amplifier for 5 GHz IEE 802.11a/n WLAN embedded applications. The device operates on the 4.9 to 5.9 GHz band, and offers a wide operating voltage of 3.3V to 5V. The SST11CP15 features a high linear output power of 18 dBm at 2.5 percent EVM, using 802.11a OFDM 54 Mbps at 3.3V, and 20 dBm at 5.0V, and offers an output power of 23 dBm at mask compliance of 6 Mbps, at 3.3V. The device is offered in a compact, 2 mm x 2 mm x .55 mm, 12-pin QFN package. It is ideal for 5 GHz WLAN applications where small size and high-efficiency operation are required, such as in wireless multimedia and MIMO applications for broadband gateway and consumer-electronics equipment.

Microchip's latest 2.4 GHz 256-QAM RF high-power amplifier—the SST12CP21—offers ultra low EVM and current consumption for 256-QAM and IEEE 802.11n systems. The SST12CP21 delivers high linear output power of up to 23 dBm at 1.75% dynamic EVM, with MCS9 HT40 MHz bandwidth modulation at 5V and 320 mA current consumption. Additionally, the SST12CP21 delivers 25 dBm linear power at 3% EVM with only 350 mA current consumption for 802.11g/n applications. This performance significantly extends the range of 802.11b/g/n WLAN and MIMO systems, while consuming extremely low current at the maximum 256-QAM data rate. The SST12CP21 is also spectrum mask compliant up to 28 dBm for 802.11b/g communication. Board space is reduced by the small 3x3x0.55 mm, 16-pin QFN package that matches a popular pin-out. For more info, visit: www.microchip.com/get/L3PX

Microchip expanded its RF portfolio with the new SST11CP16 5 GHz power amplifier (PA). This PA supports the new IEEE 802.11ac ultra high data rate Wi-Fi® standard for 351 Mbps with 1.8% Error Vector Magnitude (EVM) at 19 dBM output power, enabling a longer range. Additionally, the SST11CP16 provides low operating current of 360 mA at 22 dBm, which enables more transmission channels at a higher data rate, per system. To conserve space, this PA is offered in a 3x3x.45 mm, 16-pin QFN package. For more info, visit: www.microchip.com/get/D2JG

SchmartBoard|ez 12 Pins to 24 Pins .5mm & .65mm

 

www.schmartboard.com/index.asp?page=products_csp&id=74

About the circuit, The design uses the Maxim MAX846AEEE, 16 pin QSOP integrated circuit to build a simple battery charger for charging single and double cell Li+ battery packs at 4.2 VDC or 8.4 VDC. I designed this charger for a 3.6VDC/4.2 AH cell and one can conveniently design his own charger for other ratings of Li+ batteries. The circuit is simple, uses a series pass PNP transistor and a diode with some passive components. I designed it for a Solar Lantern application. A Solar Lantern that runs from Lion batteries using 3 mm White Leds ( 40 and 80 nos., 1500mcd ) and can be charged from a 12VDC source; either a solar cell, car battery or AC Mains adapter. Read more at: www.schmartdeveloper.org/tiki-index.php?page=Fox+Radio&am...

 

About myself a Radio Ham, Call Sign VU2KFR since 1984, 44 years old, a member of ARRL USA (since 1989) and IEEE, USA (since 2000), an Electronics Communication Engineer by profession and employed as VP, RF & Wireless for a Singapore based MNC to head their design centre in Kolkata-India developing RF/ Wireless, GSM-GPRS, GPS, CDMA, RFID and all to do with RF applications (www.esmartholdings.com)

 

I am a professional Gambler !!!! ie. a regular contestant at Circuit Cellar Design Contests since 2002 ( catch me at www.circuitcellar.com) and also the Winner of the TI,USA, "Analog Design Challenge 2001 "( www.ti.com/sc/docs/news/2001/01120.htm).

Nancy

SchmartBoard|ez 10 Pins and 32 pins, .5mm Pitch

 

This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering

 

www.schmartboard.com/index.asp?page=products_csp&id=76

PCB for cc1100 wireless tranceiver (reference design). I needed to prototype a few wireless sensor platforms (aka smartdust, motes) using the brand spanking new cc1100 tranceiver from chipcon/ti. This chip only comes in a qfn package, with a bottom pad (the primary ground) that MUST be soldered to the PCB. There was no way I could do this middle pad by hand, so I tried the griddle reflow method. Passive/supporting components are 0402 size (0.5mm by 1mm). These photos document the PCB fabrication using inkjet transparencies and a test solder reflow using a griddle (thanks spark fun). I'm astounded, tiny prototypes made entirely in my kitchen!

 

About the PCB making process: the PCBs were make using the photo process with photo-positive pre-coated boards. Artwork was printed on an inkjet transparency using all black ink. The printer was set to its maximum resolution (something like a fake 2400 dpi). Two copies of the art were taped together to give a thicker mask. I think that I could do it in a single layer if I printed using all colors for black (called high quality black on my printer), or using photographic cartridges with uv resistant ink. As of yet, I am to cheap to buy a new cartridge. I'm thinking of asking the inkjet refill shop if they would fill an empty black cartridge with a UV resistant color ink.

 

About the reflow: I used the sparkfun griddle reflow method. The solder paste was a $5 tube of "silver solder paste" from mouser. I made a small pool of paste on a note card. I dipped the syringe tip in the solder and dotted the pads on the board. I cranked the griddle up (240c) and in five minutes the parts were soldered and aligned.

 

About the cc1100: the cc1100 is a low power tranceiver for wireless networks. It is a big upgrade from the cc1000 used in many previous generations of MOTES (mica2, mica2dot, etc). I had a really hard time actually getting the cc1100 - ti won't sample and distributors all list them on back order if you don't want a whole reel. The boards shown here will use a draft (E) revision of the silicon. That was the only thing I could find anywhere in the world. I hope to get my hands on the final silicon soon (hint, hint TI).

Microchip's latest 2.4 GHz 256-QAM RF high-power amplifier—the SST12CP21—offers ultra low EVM and current consumption for 256-QAM and IEEE 802.11n systems. The SST12CP21 delivers high linear output power of up to 23 dBm at 1.75% dynamic EVM, with MCS9 HT40 MHz bandwidth modulation at 5V and 320 mA current consumption. Additionally, the SST12CP21 delivers 25 dBm linear power at 3% EVM with only 350 mA current consumption for 802.11g/n applications. This performance significantly extends the range of 802.11b/g/n WLAN and MIMO systems, while consuming extremely low current at the maximum 256-QAM data rate. The SST12CP21 is also spectrum mask compliant up to 28 dBm for 802.11b/g communication. Board space is reduced by the small 3x3x0.55 mm, 16-pin QFN package that matches a popular pin-out. For more info, visit: www.microchip.com/get/L3PX

SchmartBoard|ez 8 and 48 pin 0.5mm Pitch

 

This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering

 

www.schmartboard.com/index.asp?page=products_csp&id=78

48-7393, Place de la Chapelle, 3-8-2012.

Los microcontroladores STM32W combinan rendimiento, densidad de código y ventajas de integración con excelente radio IEE 802.15.4.

 

STMicroelectronics, uno de los más importantes fabricantes de microcontroladores, ha ampliado su catálogo de dispositivos STM32 con la introducción de la familia STM32W, que se caracteriza por una radio IEEE 802.15.4 integrada para crear una plataforma System-on-Chip que soporta el diseño de red de sensor inalámbrico embebido.

 

IEEE 802.15.4, que es un estándar abierto para radio de mínimo consumo y bajo ratio de datos en la banda de 2.4 GHz sin licencia, ha sido ampliamente utilizado en comunicaciones y aplicaciones de red como medición inteligente de energía, automatización doméstica, equipos de seguridad y monitorización, y controles remotos. Además, la Alianza ZigBee™ ha especificado IEEE 802.15.4 como la plataforma de radio para el protocolo ZigBee, muy popular en tareas de medición automática y aplicaciones con sensores.

 

La familia STM32W de ST implementa la capa física (PHY) IEEE 802.15.4 y la capa Media Access Control (MAC), dotando a los desarrolladores de la flexibilidad necesaria para cumplir con las especificaciones ZigBee o crear cualquier protocolo inalámbrico de red con interconexión al IEEE 802.15.4 MAC estandarizado. Otros protocolos bien conocidos son ZigBee RF4CE para controles remotos de radiofrecuencia o 6LoWPAN para soluciones de Internet embebido inalámbrico. El soporte de software para las unidades STM32W incluye librerías para la última especificación ZigBee PRO, así como ZigBee RF4CE e IEEE 802.15.4 MAC.

 

Los nuevos microcontroladores combinan los beneficios de una plataforma de radio ‘best-in-class’ con el rendimiento, la flexibilidad y la escalabilidad de la arquitectura STM32. El catálogo de ST, el más amplio de la industria, se distingue por el uso del avanzado procesador ARM Cortex-M3 de 32 bit y fue el primero en “eliminar las barreras” para extender el uso de 32 bit en aplicaciones embebidas. Ventajas como elevado rendimiento de proceso, gestión de potencia y alta integración, así como comportamiento en tiempo real, son muy atractivas para un gran número de desarrolladores de la plataforma STM32 a nivel mundial.

 

La familia STM32W ofrece compatibilidad con otras versiones STM32 y cumple con el “ecosistema” de desarrollo de ST. Los desarrolladores también se benefician de una excelente densidad de código, que, al menos, es un 20 por ciento superior al de otras arquitecturas gracias a la eficiencia del núcleo Cortex-M3.

 

Cada unidad STM32W es un SoC que combina el mejor rendimiento RF IEEE 802.15.4 y proceso de 32 bit. Los dispositivos pueden transmitir una potencia de salida de hasta 7 dBm y soportar hasta 107 dB de ‘link budget’, alcanzar una sensibilidad de receptor de 100 dBm y permitir la coexistencia con redes Wi-Fi y Bluetooth, que también operan en la banda de frecuencia de 2.4 GHz.

 

Las características se completan con bajo consumo de energía (27 mA en modo “recepción” y 31 mA en modo “transmisión”, e implementado un modo ‘Deep-Sleep’ de 1 µA para ayudar en tareas de gestión), SRAM de 8 Kbyte, Flash de 128 Kbyte para almacenamiento de código y encriptación AES embebida con aceleración de hardware.

 

Los recursos para propósitos generales incluyen un ADC flexible, un interface serie SPI / UART / TWI, múltiples temporizadores y 24 GPIOs con entradas ‘Schmitt-trigger’. La operación ‘single-voltage’ de 2.1 a 3.6 V contribuye a simplificar el diseño, incrementar la integración y reducir el número de componentes externos. Además, sólo se requiere un cristal de 24 MHz o un cristal de 32.768 kHz opcional para incrementar aún más la precisión. También existe soporte para un amplificador de potencia.

 

La combinación inteligente de radio de 2.4 GHz y arquitectura de 32 bit logra un sensacional rendimiento de red, mientras que el bajo consumo de energía consigue ampliar la duración de la batería.

 

La familia STM32W se encuentra disponible en encapsulados QFN de 40 pines y 6 x 6 mm compatibles ‘pin-to-pin’ con el SN260, y QFN de 48 pines y 7 x 7 mm compatibles con el SN250.

Microchip's HID-class MCP2210 USB to SPI protocol converter is the simplest, smallest-footprint and most cost-effective option for adding USB-Certified connectivity to SPI-based systems. Microchip also provides free downloads of supporting software drivers, DLLs and a PC configuration tool, in addition to an evaluation board, to make it fast and simple for designers without USB expertise to add USB connectivity. The converter comes in small, 20-pin SSOP and 5x5 mm QFN packages, for space-constrained applications. Additionally, the MCP2210 has nine flexible, general-purpose I/O that can be configured via a PC as standard digital I/O pins or in alternate configurations, providing additional system I/O that simplify designs and support a wide range of applications. For more info, visit: www.microchip.com/mcp2210

My company, AVIX-RT, develops and markets an RTOS for Microchip PIC24/dsPIC microcontrollers. Since the main focus is on software, for hardware I am always looking for easy solutions where I do not have to spend a lot of time reaching my goals. I found such a solution with Schmartboard. Schmartboard enables me not only to create a converter, making it easier to work with SMD devices. Schmartboards offer much more than this. These boards allow me to put complete circuits on a single board reducing footprint and ‘Time to Prototype’, this all with minimal effort. I really love these boards since they allow me to focus on my main goals. More information can be found at www.avix-rt.com

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PCB for cc1100 wireless tranceiver (reference design). I needed to prototype a few wireless sensor platforms (aka smartdust, motes) using the brand spanking new cc1100 tranceiver from chipcon/ti. This chip only comes in a qfn package, with a bottom pad (the primary ground) that MUST be soldered to the PCB. There was no way I could do this middle pad by hand, so I tried the griddle reflow method. Passive/supporting components are 0402 size (0.5mm by 1mm). These photos document the PCB fabrication using inkjet transparencies and a test solder reflow using a griddle (thanks spark fun). I'm astounded, tiny prototypes made entirely in my kitchen!

 

About the PCB making process: the PCBs were make using the photo process with photo-positive pre-coated boards. Artwork was printed on an inkjet transparency using all black ink. The printer was set to its maximum resolution (something like a fake 2400 dpi). Two copies of the art were taped together to give a thicker mask. I think that I could do it in a single layer if I printed using all colors for black (called high quality black on my printer), or using photographic cartridges with uv resistant ink. As of yet, I am to cheap to buy a new cartridge. I'm thinking of asking the inkjet refill shop if they would fill an empty black cartridge with a UV resistant color ink.

 

About the reflow: I used the sparkfun griddle reflow method. The solder paste was a $5 tube of "silver solder paste" from mouser. I made a small pool of paste on a note card. I dipped the syringe tip in the solder and dotted the pads on the board. I cranked the griddle up (240c) and in five minutes the parts were soldered and aligned.

 

About the cc1100: the cc1100 is a low power tranceiver for wireless networks. It is a big upgrade from the cc1000 used in many previous generations of MOTES (mica2, mica2dot, etc). I had a really hard time actually getting the cc1100 - ti won't sample and distributors all list them on back order if you don't want a whole reel. The boards shown here will use a draft (E) revision of the silicon. That was the only thing I could find anywhere in the world. I hope to get my hands on the final silicon soon (hint, hint TI).

Kevin Tan of Clovis CA

  

PCB for cc1100 wireless tranceiver (reference design). I needed to prototype a few wireless sensor platforms (aka smartdust, motes) using the brand spanking new cc1100 tranceiver from chipcon/ti. This chip only comes in a qfn package, with a bottom pad (the primary ground) that MUST be soldered to the PCB. There was no way I could do this middle pad by hand, so I tried the griddle reflow method. Passive/supporting components are 0402 size (0.5mm by 1mm). These photos document the PCB fabrication using inkjet transparencies and a test solder reflow using a griddle (thanks spark fun). I'm astounded, tiny prototypes made entirely in my kitchen!

 

About the PCB making process: the PCBs were make using the photo process with photo-positive pre-coated boards. Artwork was printed on an inkjet transparency using all black ink. The printer was set to its maximum resolution (something like a fake 2400 dpi). Two copies of the art were taped together to give a thicker mask. I think that I could do it in a single layer if I printed using all colors for black (called high quality black on my printer), or using photographic cartridges with uv resistant ink. As of yet, I am to cheap to buy a new cartridge. I'm thinking of asking the inkjet refill shop if they would fill an empty black cartridge with a UV resistant color ink.

 

About the reflow: I used the sparkfun griddle reflow method. The solder paste was a $5 tube of "silver solder paste" from mouser. I made a small pool of paste on a note card. I dipped the syringe tip in the solder and dotted the pads on the board. I cranked the griddle up (240c) and in five minutes the parts were soldered and aligned.

 

About the cc1100: the cc1100 is a low power tranceiver for wireless networks. It is a big upgrade from the cc1000 used in many previous generations of MOTES (mica2, mica2dot, etc). I had a really hard time actually getting the cc1100 - ti won't sample and distributors all list them on back order if you don't want a whole reel. The boards shown here will use a draft (E) revision of the silicon. That was the only thing I could find anywhere in the world. I hope to get my hands on the final silicon soon (hint, hint TI).

PCB for cc1100 wireless tranceiver (reference design). I needed to prototype a few wireless sensor platforms (aka smartdust, motes) using the brand spanking new cc1100 tranceiver from chipcon/ti. This chip only comes in a qfn package, with a bottom pad (the primary ground) that MUST be soldered to the PCB. There was no way I could do this middle pad by hand, so I tried the griddle reflow method. Passive/supporting components are 0402 size (0.5mm by 1mm). These photos document the PCB fabrication using inkjet transparencies and a test solder reflow using a griddle (thanks spark fun). I'm astounded, tiny prototypes made entirely in my kitchen!

 

About the PCB making process: the PCBs were make using the photo process with photo-positive pre-coated boards. Artwork was printed on an inkjet transparency using all black ink. The printer was set to its maximum resolution (something like a fake 2400 dpi). Two copies of the art were taped together to give a thicker mask. I think that I could do it in a single layer if I printed using all colors for black (called high quality black on my printer), or using photographic cartridges with uv resistant ink. As of yet, I am to cheap to buy a new cartridge. I'm thinking of asking the inkjet refill shop if they would fill an empty black cartridge with a UV resistant color ink.

 

About the reflow: I used the sparkfun griddle reflow method. The solder paste was a $5 tube of "silver solder paste" from mouser. I made a small pool of paste on a note card. I dipped the syringe tip in the solder and dotted the pads on the board. I cranked the griddle up (240c) and in five minutes the parts were soldered and aligned.

 

About the cc1100: the cc1100 is a low power tranceiver for wireless networks. It is a big upgrade from the cc1000 used in many previous generations of MOTES (mica2, mica2dot, etc). I had a really hard time actually getting the cc1100 - ti won't sample and distributors all list them on back order if you don't want a whole reel. The boards shown here will use a draft (E) revision of the silicon. That was the only thing I could find anywhere in the world. I hope to get my hands on the final silicon soon (hint, hint TI).

SchmartBoard|ez 64 Pins, 0.5mm Pitch

 

This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering

 

www.schmartboard.com/index.asp?page=products_csp&id=82

PCB for cc1100 wireless tranceiver (reference design). I needed to prototype a few wireless sensor platforms (aka smartdust, motes) using the brand spanking new cc1100 tranceiver from chipcon/ti. This chip only comes in a qfn package, with a bottom pad (the primary ground) that MUST be soldered to the PCB. There was no way I could do this middle pad by hand, so I tried the griddle reflow method. Passive/supporting components are 0402 size (0.5mm by 1mm). These photos document the PCB fabrication using inkjet transparencies and a test solder reflow using a griddle (thanks spark fun). I'm astounded, tiny prototypes made entirely in my kitchen!

 

About the PCB making process: the PCBs were make using the photo process with photo-positive pre-coated boards. Artwork was printed on an inkjet transparency using all black ink. The printer was set to its maximum resolution (something like a fake 2400 dpi). Two copies of the art were taped together to give a thicker mask. I think that I could do it in a single layer if I printed using all colors for black (called high quality black on my printer), or using photographic cartridges with uv resistant ink. As of yet, I am to cheap to buy a new cartridge. I'm thinking of asking the inkjet refill shop if they would fill an empty black cartridge with a UV resistant color ink.

 

About the reflow: I used the sparkfun griddle reflow method. The solder paste was a $5 tube of "silver solder paste" from mouser. I made a small pool of paste on a note card. I dipped the syringe tip in the solder and dotted the pads on the board. I cranked the griddle up (240c) and in five minutes the parts were soldered and aligned.

 

About the cc1100: the cc1100 is a low power tranceiver for wireless networks. It is a big upgrade from the cc1000 used in many previous generations of MOTES (mica2, mica2dot, etc). I had a really hard time actually getting the cc1100 - ti won't sample and distributors all list them on back order if you don't want a whole reel. The boards shown here will use a draft (E) revision of the silicon. That was the only thing I could find anywhere in the world. I hope to get my hands on the final silicon soon (hint, hint TI).

PCB for cc1100 wireless tranceiver (reference design). I needed to prototype a few wireless sensor platforms (aka smartdust, motes) using the brand spanking new cc1100 tranceiver from chipcon/ti. This chip only comes in a qfn package, with a bottom pad (the primary ground) that MUST be soldered to the PCB. There was no way I could do this middle pad by hand, so I tried the griddle reflow method. Passive/supporting components are 0402 size (0.5mm by 1mm). These photos document the PCB fabrication using inkjet transparencies and a test solder reflow using a griddle (thanks spark fun). I'm astounded, tiny prototypes made entirely in my kitchen!

 

About the PCB making process: the PCBs were make using the photo process with photo-positive pre-coated boards. Artwork was printed on an inkjet transparency using all black ink. The printer was set to its maximum resolution (something like a fake 2400 dpi). Two copies of the art were taped together to give a thicker mask. I think that I could do it in a single layer if I printed using all colors for black (called high quality black on my printer), or using photographic cartridges with uv resistant ink. As of yet, I am to cheap to buy a new cartridge. I'm thinking of asking the inkjet refill shop if they would fill an empty black cartridge with a UV resistant color ink.

 

About the reflow: I used the sparkfun griddle reflow method. The solder paste was a $5 tube of "silver solder paste" from mouser. I made a small pool of paste on a note card. I dipped the syringe tip in the solder and dotted the pads on the board. I cranked the griddle up (240c) and in five minutes the parts were soldered and aligned.

 

About the cc1100: the cc1100 is a low power tranceiver for wireless networks. It is a big upgrade from the cc1000 used in many previous generations of MOTES (mica2, mica2dot, etc). I had a really hard time actually getting the cc1100 - ti won't sample and distributors all list them on back order if you don't want a whole reel. The boards shown here will use a draft (E) revision of the silicon. That was the only thing I could find anywhere in the world. I hope to get my hands on the final silicon soon (hint, hint TI).

This picture is from a USB to RS232 converter. See the attached URL for the schematic. In particular I installed the converter in a homemade footpedal to be used with Express Scribe transcription software, see attached URL. The homemade footpedal's connections hook up to the serial port of the converter; then the USB connector goes to a laptop's USB port

Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced the new SST11CP15 RF power amplifier (amp) for 5 GHz IEE 802.11a/n WLAN embedded applications. The device operates on the 4.9 to 5.9 GHz band, and offers a wide operating voltage of 3.3V to 5V. The SST11CP15 features a high linear output power of 18 dBm at 2.5 percent EVM, using 802.11a OFDM 54 Mbps at 3.3V, and 20 dBm at 5.0V, and offers an output power of 23 dBm at mask compliance of 6 Mbps, at 3.3V. The device is offered in a compact, 2 mm x 2 mm x .55 mm, 12-pin QFN package. It is ideal for 5 GHz WLAN applications where small size and high-efficiency operation are required, such as in wireless multimedia and MIMO applications for broadband gateway and consumer-electronics equipment.

Scott Livingston adapted my GoodFET31 design to QFN, making the smallest GoodFET yet.

The 3mm QFN makes those 30ga. kynar wires look a lot bigger...

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سÌ{\{O0ð¼

SchmartBoard|ez 56 Pins, 0.5mm Pitch

 

This product utilizes the "EZ" technology to assure fast, easy, and flawless hand soldering

 

www.schmartboard.com/index.asp?page=products_csp&id=80