Temperature Tolerance with Yiyang Li
Assistant Professor of Materials Science and Engineering Yiyang Li, prepares to test the temperature tolerance of a high-temperature memory chip in the Herbert H. Dow Building on the North Campus of the University of Michigan in Ann Arbor, on November 26, 2024.
The Li+ Group is conducting research to develop new electrochemical materials for energy storage, brain-inspired computing, and information processing.
Photo: Brenda Ahearn/University of Michigan, College of Engineering, Communications and Marketing
Temperature Tolerance with Yiyang Li
Assistant Professor of Materials Science and Engineering Yiyang Li, prepares to test the temperature tolerance of a high-temperature memory chip in the Herbert H. Dow Building on the North Campus of the University of Michigan in Ann Arbor, on November 26, 2024.
The Li+ Group is conducting research to develop new electrochemical materials for energy storage, brain-inspired computing, and information processing.
Photo: Brenda Ahearn/University of Michigan, College of Engineering, Communications and Marketing