Thin Wafer Processing and Dicing Equipment Market

A wafer is a thin slice of semiconductor material, and dicing is a process used to cut or groove semiconductors, glass crystals, and many other types of materials. The equipment used in this process is known as dicing equipment. Due to the increasing demand for thinner wafers and thicker chips, dicing technology is constantly evolving, which has a great impact on the dicing equipment industry. Grinding is also a process to reduce the thickness of wafers according to the requirements of various industries such as electronics, automobiles, and communication equipment. The handling and processing of thin wafers are now done by temporarily bonding them to a rigid carrier wafer, which provides mechanical support during wafer thinning and backside processing. The thin wafer is separated from a carrier wafer after backside processing and affixed to dicing tape on the film frame. It is currently seen that the integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers is increasing rapidly.

 

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