bgcrain03
Xilinx Spartan XA3S250E FPGA die shot
Die shot of a Xilinx Spartan XA3S250E-TQG144DGQ1021. This fpga is an automotive specific fpga which contains 612 CLBs (configurable logic Blocks), 4 DCMs (Digital clock Managers), 12 dedicated multipliers, 216k of ROM (configured in 2 distinct rows of 108k) and 172 I/O blocks. This chip was manufactured using a 90nm CMOS process, using 250,000 logic gates. This chip is particularly interesting due to the fact the datasheet has a die diagram with detailed descriptions of each block. This one was removed from a blind spot detection system used in GM vehicles manufactured about a decade ago.
Datasheet: docs.amd.com/v/u/en-US/ds635
Xilinx Spartan XA3S250E FPGA die shot
Die shot of a Xilinx Spartan XA3S250E-TQG144DGQ1021. This fpga is an automotive specific fpga which contains 612 CLBs (configurable logic Blocks), 4 DCMs (Digital clock Managers), 12 dedicated multipliers, 216k of ROM (configured in 2 distinct rows of 108k) and 172 I/O blocks. This chip was manufactured using a 90nm CMOS process, using 250,000 logic gates. This chip is particularly interesting due to the fact the datasheet has a die diagram with detailed descriptions of each block. This one was removed from a blind spot detection system used in GM vehicles manufactured about a decade ago.
Datasheet: docs.amd.com/v/u/en-US/ds635