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Getting ready to compress the devices between the board and the heatsink. I have a thought about this method used by some companies, including Soundstream... It does not really apply even pressure across the device being as the clamping action takes place between a pair. If tightened a little too snug, the outer edge of the device will lift up and create a tiny gap between it and the heatsink. As a result, it will only transfer heat on one side and fail. To avoid this, I use a very small torque wrench and determine what is needed to keep it flat, and then use that figure to tighten the entire set. It has proven reliable.

Done