ibmchips
2007 - Self Assembling Chips
IBM Fellow Dan Edelstein with an experimental version of IBM's latest-generation microprocessor. The chip uses a vacuum to insulate the miles of wiring that connect its millions of transistors. The "airgaps" were created using a self-assembly technology that creates a uniform pattern of trillions of nanoscale holes in a wafer. The technique draws on nature's ability to form intricate patterns such as snowflakes and sea shells.
2007 - Self Assembling Chips
IBM Fellow Dan Edelstein with an experimental version of IBM's latest-generation microprocessor. The chip uses a vacuum to insulate the miles of wiring that connect its millions of transistors. The "airgaps" were created using a self-assembly technology that creates a uniform pattern of trillions of nanoscale holes in a wafer. The technique draws on nature's ability to form intricate patterns such as snowflakes and sea shells.