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High-Density PCBA

High-Density PCBA Manufacturing Fixes

High-density PCBA (e.g., 01005 components, 0.3mm-pitch BGA) faces 3 key issues, with quick solutions:

1.Ultra-fine placement:Use high-precision mounters (vision resolution ≥5μm) to keep deviation <0.01mm;print solder paste with 0.12-0.15mm laser-cut steel meshes (volume tolerance ±10%).

2.Signal integrity:Separate analog/digital layers;control impedance (50Ω for coaxial, 90Ω for differential pairs) with consistent wire width (0.2mm for 50Ω on 1oz copper);add ground vias every 5-10mm to cut crosstalk.

3.Heat-sensitive components:Adopt step soldering - high-temp solder (Sn96.5Ag3.0Cu0.5, 240-250℃) for heat-resistant chips, low-temp solder (Sn42Bi58, 138℃) for sensitive parts;clean with no-clean flux post-soldering.

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Uploaded on September 29, 2025